MSI
Hetis 915
Webopedia The only online dictionary and search engine you need for computer and Internet technology.
CPU Chip Information (Toms Hardware Guide) DDR SDRAM Information (end of this page)
CPU
Chip Sockets:
Pentium II and early Pentium III mounts in a Slot
1 socket.
Celeron & AMD K6 chips mounts in a Socket 370 (can use a Socket
370 to Slot 1 converter)
Pentium III mounts in a Socket 370, aka FC-PGA (Flip
Chip - Pin Grid Array).
Celeron 1.7GHz & Pentium 4 1.8GHz
mounts in Socket 478
Mobile P4 mounts in µFC-PGA socket
Pentium
Xeon mounts in Socket 603
Prices do not include GST and may change without notice. lrh
MSI
Hetis 915Slim Desktop Type, dimensions: 94 (H) x 320 (W)
x 330 (D) mm
Data:
click here lgb
CPU:
Socket 775 Intel® Pentium® 4 processor, up to 3.6GHz and above
Supports P4 Prescott & Celeron-D
CPU
FSB @ 800/533MHz
Slim
P4 chassis 94 (H) x 320 (W) x 330mm (D)<10 Litre without bezel
External
Device: 1 x ATA/SATA CD-ROM/RW or DVD-ROM/DVD RW (Optional)
1 x USB 2.0 Card Reader (Optional)
Internal Support: 1 x ATA/Serial ATA SATA
HDD
Front Access: USB 2.0 x 4
4-in
1394 x 1 (NA for lite version)
High
definition Headphone-out / Mic-in 1
Rear Access:
. Gigabit
LAN x 1
. DVI x 1 (NA for lite version)
. USB 2.0 x 2
. 6-pin 1394 x
1 (NA for lite version)
. 2 TV-out: AV-out & S-video out (NA for lite version)
.
Graphics Card (4/8/16/32/64 MB)
. PS2 x 2/COM x 2
High definition Audio
connector
Line-in / Line-out / Mic-in / Rear Speaker Out / Center Speaker
Out / Side aSurround Out
Easy assembly & installation Module design with
swappable parts
Silent operation: Idle 29dB
Expandability: 2 available
PCI slots
Power Supply
Dimension: 80 (H) x 120
(W) x 120 mm (D)
PFC: Yes
Waltage: 250 Max
Certificate: FCC, UL, CUL, BSMI, CB, NEMKO,
TUV, CCC
AC Input: 100~127/200~240 VAC, Switch Selectable, Auto Protection
DC Output: +3.3V 16A, +5V 16A, +12V 16A, -12V 0.8A, +5Vsb 2A
ON/OFF
Switch: Yes
MB Specification
CPU: Support Socket
775 Intel® Pentium® 4 processor, up to 3.6GHz and above
Support P4 Prescott &
Celeron-D CPU
FSB
@ 800/533MHz
Chipset: Intel® 915GV / ICH6 chipset
Main
Memory: 2 DIMM for DDR 400/333 memory, up to 2GB
Expansion Slot:
2 x 32-bit PCI slots
Audio: On-board High definition
7.1 Audio channels S/W audio codec (Realtek ALC880)
LAN: On-board
Intel® Giga bit LAN
Dimensions: 33.4(L) x 19.0(W), 5 mounting holes
DDR (Double Data Rate) SDRAM is
similar to conventional SDRAM,
but doubles the rate by transferring data twice
per cycle.
It uses 2.5 volts as opposed to 3.3 volts used in SDR SDRAM,
and requires 184-pin DIMM modules rather than 168-pin DIMM modules used by
SDR SDRAM.
Two types of DDR are available at the time of writing: PC1600
& PC2100.
PC1600 DDR SDRAM running at 100MHz will produce about 1.6GB/s
memory bandwidth.
PC2100 running at 133MHz will produce 2.1GB/s memory bandwidth.
High memory bandwidth makes DDR an ideal solution for high performance PC,
workstations and servers.
LPX:
The distinguishing characteristic of LPX is that expansion boards are inserted
into a riser that contains several slots.
So the expansion boards are parallel
to the motherboard rather than perpendicular to it as in other common form factors,
such as AT and ATX.
The LPX design allows for smaller cases, but the number
of expansion boards is usually limited to two or three.
The LPX form factor
is gradually being replaced by NLX (see below).
AMR
= Audio / Modem Riser, developed by Intel for packaging the analog I/O audio
functions of modem circuitry together with a codec chip (which converts back and
forth from analog to digital) on a small board that plugs directly into a computer's
motherboard.
The small board is called a riser apparently because it rises
above the motherboard rather than laying flatly on it.
The AMR card can also
provide the foundation for higher-quality audio solutions such as 3D positional
audio and better MIDI music production.
Intel provides more
information.
PTI = Panel Link / TV out Interface
NLX:
A new form
factor designed by Intel for PC motherboards.
The NLX form factor features
a number of improvements over the current LPX form factor and is
expected
to be widely implemented starting in 1998.
Its features include:
Support for larger memory modules and DIMMs
Support for the newest microprocessors,
including the Pentium II using SEC packaging.
Support for AGP video cards.
Better access to motherboard components
Support for dockable designs
in which the motherboard can be removed without tools