Advantech will upgrade its industrial motherboards and IPC systems to the latest 13th Gen. Intel® Core™ i9/i7/i5/i3 processors in 2023. The industrial ATX motherboards, PICMG 1.3 full-size single board computers (SBC), modular IPCs and compact IPCs will all be upgraded to the 13th gen processors, which feature up to 24 cores and 32 threads to significantly boost computing performance. These upgraded systems are ideal for smart factory and machine automation, machine vision, transportation and edge AI applications.
Leap forward in Intel® Core™ processor architecture and performance
13th Gen Intel® Core™ processors feature a performance hybrid architecture, integrating up to eight performance-cores (P-cores) that enhance workload consolidation, and up to sixteen efficient-cores (E-cores) that enhance background task management and multitasking. This will boost performance up to 1.04x times faster in single-thread performance and up to 1.34x times faster in multi-thread performance compared to 12th Gen Intel® Core™ processors.
The 13th Gen Intel® Core™ processor series introduces support for DDR5-5600 memory modules (or DDR4-3200), leading to a significant bandwidth enhancement. The upgrade to PCIe 5.0/4.0 and more lanes increase the platform expansion possibilities and the ability to support high numbers of simultaneous applications.
A range of products to get the upgrade
The industrial ATX motherboards and the AIMB-788 and AIMB-708 series with 13th Gen. Intel® Core™/Pentium®/Celeron® LGA1700 processors are equipped with 7 x PCIe/PCI expansion slots (including 1 x PCIe x16 Gen 4, and up to 3 x PCIe x4 Gen 3), M.2 (NVMe) and DDR4-3200 memory. They offer higher computing performance, expandability and cost-effectiveness. This satisfies a wide range of applications in industrial automation and video surveillance that require seamless upgrades, long-term support, proven reliability and strict revision control. The upgrade also includes PCE-5133 and PCE-5033. These PICMG 1.3 full-size single board computers feature multiple backplanes, diverse I/O, and various expansion slots which deliver unrivalled flexibility and performance.
This major upgrade will also cover MIC-770 V3, IPC-320 and PCE-2133/2033. MIC-770 V3 is an embedded box IPC with high performance and a modular, fanless design, which is perfect for deploying in heavy industrial hazardous environments. IPC-320 will have a whole new launch for compact and tower IPCs with the latest 13th gen Intel® Core™ I CPUs. These systems are designed for central control rooms in substations and industrial automation requiring industrial-grade design, longevity support, silent operation and low noise (34dB) accoustics. PCE-2133 and PCE-2033 are compact motherboards bundled with the ultra-compact IPC-200 chassis series (IPC-220/240/242), designed for machine vision and motion control in equipment manufacturing and the semiconductor industry.
Key product specifications
-Advantech Industrial ATX motherboards AIMB-788 (Q670E)
- 13th Gen. Intel® Core™ i9/i7/i5/i3 & Pentium®/Celeron® processor (LGA 1700).
- Four DIMM sockets up to 128 GB DDR4 3200.
- 3 x displays – VGA/HDMI/DP up to 4K, 2 x GbE LAN, 14 x USB 3.2/2.0, 6 COM, 1 x NVMe M.2 and 4 x SATA.
- 1 x PCIe x16 (Gen4), 1 x PCIe x8, 3 x PCIe x4 and 2 x PCI slots.
- Advantech WISE-DeviceOn+iBMC out-of-band remote management solution.
-Advantech Industrial ATX motherboards AIMB-708 (H610E)
- 13th Gen. Intel® Core™ i9/i7/i5/i3 & Pentium®/Celeron® processors (LGA 1700).
- Two DIMM sockets up to 64GB DDR4 3200.
- 2 x displays – HDMI/VGA, 2 x GbE LAN, 10 x USB 3.2/2.0, 6 COM, 1 x NVMe M.2 and 4 x SATA.
- 1 x PCIe x16 (Gen4), 2 x PCIe x4, and 4 x PCI slots.
- Application upgrade with the latest technology and legacy expandability.
-Advantech PICMG 1.3 full-size single board computers (PCE-5033/ PCE-5133 (H610E/ R680E)
- 13th Gen. Intel® Core™ i9/i7/i5/i3 processors (LGA 1700).
- Two DIMM sockets up to 64GB DDR5 5600 with on-die ECC.
- 3 x displays – VGA & DVI-D/DP/HDMI, 2 x GbE LAN up to 2.5G, up to 8 x USB 3.2, 2 x COM, 1 x NVMe M.2 and 6 x SATA.
- Wide range of selection of expansion backplane for various applications.
-Advantech modular IPC MIC-770 V3 (R680E/ H610E)
- 13th Gen. Intel® Core™ i9/i7/i5/i3 processors (LGA 1700).
- Two DIMM sockets up to 64GB DDR5 5600 (R680E SKU supports ECC).
- 2 x displays – VGA/HDMI, 2 x GbE LAN, 8 x USB 3.2, 2 x COM
- 1 x NVMe M.2 for R680E SKU, and Flex IO and iDoor support.
- Expansion supported via Advantech i-Modules.
- Fanless and wide operating temperature (-20 ~ 60 °C).
-Advantech Compact IPC PCE-2033/ PCE-2133 (Q670E/H610E), IPC-220/240/242 and energy efficiency ErP support, PCE-2133/ 2033 (Q670E/ H610E)
- 13th Gen. Intel® Core™ i9/i7/i5/i3 processors (LGA 1700).
- Two DIMM sockets up to 64GB DDR5 5600.
- 2 x displays – VGA/HDMI, 2 x GbE LAN (one support 2.5G), 8 x USB 3.2/2.0, 2 x COM and 1 x NVMe M.2 for Q670E SKU and iDoor support.
- 1 x power output 5 VDC/12 VDC-2A.
- Bundled sale with ultra-compact chassis IPC-220/240/242 and energy efficiency ErP support.
-Advantech Compact IPC IPC-320 (H610E)IPC-320 (H610E)
- 13th Gen. Intel® Core™ i9/i7/i5/i3 processors (LGA 1700).
- Two DIMM sockets up to 64 GB DDR4 3200.
- 2 x display – HDMI/DP, 2 x GbE LAN and 8 x USB 3.2/2.0.
- 1 x PCIe x16 (Gen4) and 1 x PCIe x4 slots.
- Quiet noise level compact tower IPC with 250W power supply.
These upgraded products will support multiple operating systems and Advantech’s WISE-DeviceOn and WISE-Cloud software platforms. The new Advantech platforms based on 13th Gen Intel Core processors are expected to be released in late 2023.
ESIS is the leading supplier of outstanding industrial electronic equipment in the Australian market since 1971. Check out our exclusive range of Fanless PCs, Industrial PCs (IPC solutions), Rugged Tablets, HMIs, Panel PCs, and other electronic components. Our Product are certified and made with high-quality custom materials for accurate results. Contact us for a detailed product catalogue or to share your queries.
Article courtesy of Advantech.
